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SinglFuse ? SF-1206S Series Applications
■ Portable memory
■ LCD monitors
■ Disk drives
■ PDAs
■ Digital cameras
■ Cell phones
■ Rechargeable battery packs
■ Battery chargers
■ Set top boxes
■ Industrial controllers
■ DVDs
SF-1206S Series - Slow Blow Surface Mount Fuses
Solder Re?ow Recommendations
250
Peak: 250 +0/-5 °C
230 °C or higher
200
180 °C
PRE-HEATING ZONE
PEAK: 250 +0/-5 °C, 5 seconds
150
100
150 °C
90 ± 30 Seconds
30 ± 10 Seconds
SOLDERING ZONE
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
50
Product Dimensions
3.1 ± 0.1
HEATING TIME
Recommended Pad Layout
(.122 ± .004)
1.55 ± 0.1
(.061 ± .004)
0.6 ± 0.1
(.024 ± .004)
1.27
(.050)
2.03
(.080)
0.5 ± 0.2
(.020 ± .008)
0.5 ± 0.2
(.020 ± .008)
0.5 ± 0.3 0.5 ± 0.3
(.020 ± .012) (.020 ± .012)
PACKAGING: 5,000 pcs./reel
Thermal Derating Curve
120
110
DIMENSIONS:
MM
(INCHES)
3.81
(.150)
Construction & Material Content
OVERCOAT
Sn PLATING
100
90
80
FUSE ELEMENT
CERAMIC SUBSTRATE
Cu / Ni PLATING
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Operating Temperature..................................................................................-40 °C to +105 °C
Storage Conditions
Temperature ................................................................................................+5 °C to +35 °C
Humidity...........................................................................................................40 % to 75 %
Shelf Life........................................................................... 2 years from manufacturing date
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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